W29N02GV W29N02GVSIAA 2G BIT 3.3V NAND FLASH MEMORY

Features

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Basic Features

Density : 2Gbit (Single chip solution)

Vcc : 2.7V to 3.6V

Bus width : x8

Operating temperature

Industrial: -40°C to 85°C

Single-Level Cell (SLC) technology.

Density: 2G-bit/256M-byte

Page size 2,112 bytes (2048 + 64 bytes)

Block size 64 pages (128K + 4K bytes)

Highest Performance

Read performance (Max.)

Random read: 25us

Sequential read cycle: 25ns

Write Erase performance

Page program time: 250us(typ.)

Block erase time: 2ms(typ.)

Endurance 100,000 Erase/Program Cycles(2)

10-years data retention

Command set

Standard NAND command set

Additional command support

Sequential Cache Read

Random Cache Read

Cache Program

Copy Back

Two-plane operation

Contact Winbond for OTP feature

Contact Winbond for block Lock feature

Lowest power consumption

Read: 25mA(typ.3V)

Program/Erase: 25mA(typ.3V)

CMOS standby: 10uA(typ.)

Space Efficient Packaging

48-pin standard TSOP1

63-ball VFBGA

Contact Winbond for stacked

packages/KGD