Qualcomm QCC-3020-0-CSP90-TR-00-0 Bluetooth 5.1 chip Bluetooth audio SoC TWS Bluetooth chip

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Model: QCC-3020-0-CSP90-TR-00-0

Year: 21+

Package: BGA

The QCC3020 chip is Qualcomm's first-generation low-power TWS Bluetooth 5.1 chip. The important function of this chip is that it can support the simultaneous use of 2 analog or digital microphones for background noise reduction during calls. The chip uses Qualcomm's 8th generation CVC Noise reduction technology.

QCC3020 adopts VFBGA package, which has low manufacturing cost and slightly larger volume. It is positioned in ordinary in-ear headphones and headphones. The chip price is cheap, and mass production does not require high PCB boards and production lines.

Application scenario: It is mainly used for HFP calls, that is, the usual calling function, and the main microphone captures the voice of the user. The secondary microphone is used to capture background noise, such as wind, car sounds, and distant speaking. CVC technology removes the noise captured by the secondary microphone through an internal software algorithm, leaving only the user's voice. In this way, the other party in the call can clearly hear the voice of the person here, and the voice of the call is full, clear, and has no sense of distance, which enhances the user's goodwill.