Supply Amphenol Connectors:HPCE Series,Power Card Edge Series,DDR5 Compression Series
Shenzhen Mingjiada Electronics Co., Ltd. is a leading global distributor of electronic components, specialising in providing high-quality electronic component solutions for various industries. With a comprehensive product range, stable supply channels, competitive pricing, and fast delivery times, the company has become a leading supplier in the electronic components sector.
Main Products: 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, vehicle networking ICs, automotive-grade ICs, communication ICs, artificial intelligence ICs, memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, WiFi chips, wireless communication modules, connectors, etc.
Supply Advantages:
Direct Supply from Original Manufacturers and Quality Assurance: All products are procured through original manufacturer channels, ensuring 100% genuine products and compliance with design specifications for performance and reliability.
Global Inventory and Rapid Delivery: The company operates warehousing centres in Shenzhen, Hong Kong, and other locations, maintaining substantial stock inventories to enable rapid shipment within 48 hours, meeting customers' urgent needs.
Flexible Procurement Models: We support a wide range of procurement needs, from small-batch sample purchases to large-volume orders, particularly suited for project validation during the R&D phase and stable supply during mass production.
Anfino HPCE Series High-Power Card Edge Connectors Detailed Overview
The Anfino HPCE (High Power Card Edge) series connectors are innovative interconnect solutions specifically designed for high-power applications. With their exceptional current-carrying capacity, optimised thermal management performance, and reliable structural design, they are the ideal choice for high-power-density applications.
The technical features of the HPCE series reflect Anfeng's deep expertise in high-power interconnect technology. The series employs a unique contact design and material selection, with each contact capable of handling up to 50A of current—far exceeding the performance limits of traditional card edge connectors. By optimising contact geometry and surface treatment processes, HPCE connectors maintain low contact resistance (<1mΩ) while significantly reducing power loss and temperature rise effects. The insulating material is made of high-temperature thermoplastic, capable of withstanding continuous operating temperatures of 150°C, meeting the long-term reliability requirements of harsh environments. Notably, the HPCE series adopts a modular design philosophy, supporting flexible configuration of power and signal contacts. Users can choose pure power, pure signal, or hybrid versions based on actual needs, greatly enhancing design flexibility.
The HPCE series connectors demonstrate significant application value in multiple critical industry sectors:
Data centre power systems: As the primary interconnection solution between server power modules and backplanes, HPCE connectors support efficient power transmission for 80Plus Titanium-rated power supplies. Their compact design helps increase rack power density.
Industrial power electronics equipment: In inverters, servo drives, and high-power UPS systems, the HPCE series reliably connects power modules and control boards, withstanding frequent power cycles and mechanical vibrations.
Renewable energy systems: Solar inverters and wind power converters utilise HPCE connectors for safe connections between DC buses and high-power AC outputs, with weather-resistant designs suited for harsh outdoor environments.
Electric vehicle powertrain systems: The HPCE series is used for high-current interconnections between battery management systems (BMS) and motor controllers, meeting automotive-grade vibration and temperature shock requirements.
Power Card Edge Series Power Card Edge Connector Technology Analysis
The Power Card Edge series is a power card edge connector solution developed by Amphenol for modern high-performance computing and communication equipment. This series of connectors is specifically designed to meet the demands of high current density and high-efficiency power transmission, and is widely used in servers, storage systems, network equipment, and high-end workstations.
The Power Card Edge series connectors incorporate multiple innovative design features, setting them apart from competitors. The series uses high-conductivity copper alloy contacts combined with selective gold plating, achieving extremely low contact resistance (typical value 0.5mΩ) and a current carrying capacity of up to 40A per contact. Its unique ‘dual-beam’ contact design ensures stable contact pressure distribution, maintaining reliable electrical connections even in vibrating environments. The connector pitch is optimised to 3.0mm, ensuring sufficient electrical clearance while achieving high power density. The insulator is made of high-temperature liquid crystal polymer (LCP) material, offering excellent heat resistance (UL94 V-0 flame retardant rating) and dimensional stability, capable of withstanding the high-temperature process of SMT reflow soldering. Notably, the Power Card Edge series introduces a modular power distribution concept, allowing mixed configurations of power contacts and signal contacts with different current ratings within the same connector, providing significant flexibility for system power architecture design.
The Power Card Edge series connectors demonstrate outstanding performance in multiple critical application scenarios:
Cloud computing server power supply: Provides efficient power distribution for CPU, GPU, and memory subsystems, supporting a 48V direct power supply architecture to reduce power conversion losses.
AI accelerator card interconnect: In high-performance AI training servers, the Power Card Edge connector enables high-current connections between accelerator cards and backplanes, meeting kilowatt-level power requirements.
Telecom infrastructure equipment: Used as power interfaces for 5G baseband units and RF units, they operate in a wide temperature range from -40°C to +105°C.
Enterprise-level storage systems: Connect SSD storage modules to the backplane, supporting hot-swap operations to ensure continuous data centre operation.
DDR5 Compression Series Memory Connectors Innovative Design
The DDR5 Compression Series connectors are high-performance interconnect solutions developed by Amphenol for next-generation memory technology, specifically designed to meet the high-speed signal integrity and high-density installation requirements of DDR5 memory modules. This series of connectors supports the latest DDR5 memory standards and is widely used in high-performance computing, AI servers, workstations, and high-end desktop computers.
The DDR5 Compression Series connectors incorporate several breakthrough technologies to address the design challenges of high-speed memory interfaces. This series of connectors supports data transfer rates of up to 6400MT/s, fully meeting the performance requirements of the JEDEC DDR5 standard. By optimising the geometry and arrangement of contact components, crosstalk is reduced to less than 50% of traditional DDR4 connectors, significantly improving signal integrity. Its innovative ‘hollow contact’ design not only reduces insertion force (typical value 35g/contact) but also enhances high-frequency performance, resulting in faster rise times and clearer eye diagrams. The connector height is compressed to just 7.5mm, saving 30% space compared to standard DDR4 connectors, providing more room for system thermal design. In terms of shielding design, the DDR5 compressed series adopts a fully enclosed metal shielding cover, effectively suppressing electromagnetic interference (EMI) while providing an excellent thermal conduction path to aid in memory module cooling.
The DDR5 compressed series connectors play a critical role in multiple high-performance computing scenarios:
AI training servers: Providing reliable connections for high-bandwidth memory (HBM) and standard DDR5 DIMMs, supporting the data throughput requirements of large-scale parallel computing.
Cloud computing data centres: In ultra-high-density server configurations, the compression design allows for the installation of more memory modules within a 1U chassis, enhancing computational density.
High-performance workstations: Supports four-channel and eight-channel memory configurations to meet the memory bandwidth requirements of 4K/8K video editing and 3D rendering.
Next-generation gaming systems: Optimised signal path design ensures low latency, enhancing the gaming experience; a robust locking mechanism prevents connection loosening caused by vibration.
