Original Stock Supply Of Xilinx XC7Z030-1FFG676I SoC FPGA Chip

Shenzhen Mingjiada Electronics Co., Ltd. offers genuine, in-stock supply of the Xilinx XC7Z030-1FFG676I SoC FPGA chip—a high-performance embedded processing and programmable logic integration solution.

XC7Z030-1FFG676I Product Description

The XC7Z030-1FFG676I is a high-performance SoC FPGA chip. As a flagship model in the Xilinx Zynq®-7000 series, it features an ARM® Cortex®-A9 dual-core processor combined with a Kintex™-7 FPGA architecture, making it highly popular in industrial control, communication equipment, automotive electronics, and consumer applications.

XC7Z030-1FFG676I Product Core Features

1. High-Performance Processing System (PS)

Dual-core ARM Cortex-A9 MPCore™: Operating at up to 667MHz, each core delivers 2.5 DMIPS/MHz performance, supporting both symmetric multiprocessing (SMP) and asymmetric multiprocessing (AMP) modes

Rich memory resources: 256KB on-chip RAM (OCM), supporting DDR3/DDR3L/DDR2/LPDDR2 memory interfaces, with a maximum address space of 1GB

Multiple peripheral interfaces: Integrated CAN, Ethernet MAC, USB 2.0 OTG, SD/SDIO, SPI, I2C, UART, and other industrial-standard communication interfaces

2. Programmable Logic (PL) Section  

Kintex™-7 FPGA Architecture: Includes 125K logic cells, 19,650 adaptive logic modules (ALMs), and 9.3Mbit embedded memory  

High-Performance Signal Processing: Supports DSP48E1 Slices for accelerating real-time signal processing algorithms

Flexible I/O configuration: 130–250 user I/O pins (depending on packaging), supporting multiple voltage standards from 1.2V to 3.3V

3. Packaging and reliability

676-pin FCBGA packaging (27mm × 27mm), 1mm ball pitch, compliant with industrial-grade temperature range (-40°C to +100°C junction temperature)

Low-power design: Utilises 28nm process technology with optimised dynamic power management

Compliant with RoHS standards, lead-free and environmentally friendly

XC7Z030-1FFG676I Key Specifications

Core processor: Dual-core ARM Cortex-A9 MPCore™ with CoreSight™, supporting Linux or other real-time operating systems

FPGA logic units: Approximately 125K logic units, using 28nm Artix-7 process technology, with high logic resource and DSP Slice support

Operating frequency: Processor up to 667MHz, FPGA up to 647MHz

Storage capacity: Up to 7.3 Mb Block RAM, 256KB on-board RAM

Serial transceivers: Supports high-speed serial transceivers up to 12.5 Gbps  

I/O count: Up to 532 I/O  

Package type: 676-pin FCBGA (27x27 mm)  

Operating temperature: -40°C to +100°C (TJ)  

Power consumption range: Typical value of 1W to 15W

Peripheral interfaces: Supports CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, etc.

For purchasing the XC7Z030-1FFG676I SoC FPGA chip or for more product details, please contact Mingjiada Electronics:  

Contact person: Mr. Chen  

Phone number: +86 13410018555  

Email: sales@hkmjd.com  

Company website: www.mjdic.com