Shenzhen Mingjiada Electronics Co., Ltd., as a professional electronic component supplier, is dedicated to providing high-quality RF SoC chips to global customers.
The RF SoC chips supplied by Mingjiada Electronics cover multiple fields including wireless communications, the Internet of Things, smart homes, and industrial automation. Below are some of the major brands they offer and their representative RF SoC product models:
Brand Manufacturer Typical RF SoC Model Primary Protocols/Applications Core Features Summary
Silicon Labs
EFR32MG12P432F1024GM48-C: Zigbee, Thread, Bluetooth, ARM Cortex-M4, multi-protocol support, 19 dBm output
EFR32MG12P433F1024GM68-C: Zigbee, Thread, Bluetooth, Sub-GHz, ARM Cortex-M4, Dual-band (2.4GHz & Sub-GHz), 20 dBm output
Nordic
NRF21540-QDAA-R7: Bluetooth Low Energy, Thread, Zigbee, RF front-end module, Supports 2.4GHz range extension
STMicroelectronics
BLUENRG-355MT: Bluetooth 5.2 Low Energy, ultra-low power, programmable, supports long-range and high-speed transmission (2Mbps)
BLUENRG-345MT: Bluetooth Low Energy, 2.4GHz proprietary, high sensitivity (-97dBm @1Mbps), output power up to +8dBm, supports 125kbps long-range
BLUENRG-345MC: Bluetooth Low Energy, security/proximity applications Cortex-M0+ core, ultra-low power (10nA in shutdown mode), peak current TX 4.3mA (0dBm)
Dialog Semiconductor
DA14683-00000U22: Bluetooth 5.0, Bluetooth v5.0, integrated MCU, receive current 3.1mA, transmit current 3.4mA
DA14682-00F08A9: Bluetooth 5.0, ARM Cortex M0, built-in 8MB flash memory (DA14682), supports BLE Mesh
Qualcomm
QCA6174A: 802.11ac Wi-Fi (Wi-Fi 5), Bluetooth 5.0, 2x2 MIMO, single-chip integration of Wi-Fi and Bluetooth, supports MU-MIMO
Qorvo
QPF4259TR13: Wi-Fi 7, high-power front-end module
Texas Instruments
CC1352: Multi-band LPWAN, multi-band low-power wide-area network (LPWAN) transceiver
Notes:
Multi-protocol support: Examples include Silicon Labs' EFR32MG series chips, supporting multiple protocols such as Zigbee, Thread, and Bluetooth. These are highly suitable for applications requiring compatibility with diverse IoT ecosystems or complex network topologies.
Ultra-low power design: Particularly Nordic and ST's Bluetooth SoCs, whose power efficiency is critical for battery-powered wearables, sensor nodes, and similar devices.
High-performance integration: Chips like Qualcomm's QCA6174A-5 integrate Wi-Fi and Bluetooth functionality onto a single chip, aiding in reduced product size and simplified design.
Application-Specific Optimisation: Different chip models may prioritise aspects such as RF power, receive sensitivity, or supported protocol features (e.g., Bluetooth Mesh, long-range capabilities) to meet diverse application requirements.
Mingjiada Electronics maintains partnerships with over 500 renowned global semiconductor manufacturers, ensuring all supplied components—including RF SoC chips—are genuine originals. The company possesses substantial inventory advantages, stocking over 2 million part numbers to provide customers with one-stop electronic component procurement services.
Its RF SoC chip products find extensive application in:
Internet of Things (IoT) devices: such as smart sensors and node controllers.
Smart home: intelligent lighting and home automation systems.
Industrial automation: industrial control and remote monitoring.
Consumer electronics: wearable devices (e.g., smartwatches, health monitoring bands), wireless headphones, VR/VR controllers.
Communications infrastructure: 5G small cells, RF front-ends.
Should you be interested in the aforementioned RF SoC chips or require other component procurement services, please contact Mingjiada Electronics via:
Telephone: +86 13410018555
Email: sales@hkmjd.com
Address: Rooms 1239-1241, New Asia Guoli Building, Zhenzhong Road, Futian District, Shenzhen
Website: www.mjdic.com