Supply ST Teseo GNSS Series:TeseoVI,TeseoV,TeseoIV,TeseoIII

 

Shenzhen Mingjiada Electronics Co., Ltd. is a professional electronic components supplier. Since its establishment, it has developed into a benchmark enterprise in the field of global electronic components distribution. 

 

Our main products include: 5G chips, new energy ICs, IoT ICs, Bluetooth ICs, Telematics ICs, automotive grade ICs, communication ICs, artificial intelligence ICs, etc. In addition, we also supply memory ICs, sensor ICs, microcontroller ICs, transceiver ICs, Ethernet ICs, WiFi chips, wireless communication modules, connectors and other electronic components.

 

The company's core competitiveness is reflected in the following aspects:

Huge inventory system: the company has more than 2 million kinds of inventory advantageous models, covering military grade, industrial grade, communication and all kinds of biased and cold high-tech components, which can quickly respond to the urgent needs of customers and significantly shorten the customer's R & D and production cycle.

Strict quality assurance: all the components supplied are from original manufacturers or authorised channels, providing complete batch traceability and warranty services. The company strictly implements ISO9001:2014 quality management system to ensure the reliability and consistency of each product.

Efficient Logistics Network: Relying on our global branches and logistics partners, we are able to achieve fast delivery of 1-3 days and support flexible sourcing model as small as 1 piece. This efficient supply chain capability is particularly suitable for small lot requirements in the R&D stage and urgent order processing.

 

 

ST's Teseo family of global navigation satellite system (GNSS) integrated circuits (ICs) and modules provide high-accuracy positioning capabilities. These standalone ICs and modules support up to quad-band operation and are compatible with multiple global navigation constellations: BeiDou, Galileo, GLONASS, GPS, Navic, and QZSS.

 

GNSS IC and module types

In addition to single-die standalone ICs, the Teseo family includes modules that integrate the GNSS chipset with necessary external components for a reduced Time To First Fix (TTFF):

 

Reduced design risk and simplified development, as the complex RF path design is already done

Embedded temperature-compensated crystal oscillator (TCXO), dedicated real-time clock (RTC), SAW filter, and RF front-end components

Larger, with fewer pins, and only require the connection of an appropriate antenna

GNSS modules offer a simpler and faster development process with reduced design complexity, while standalone GNSS ICs provide more flexibility for those with the necessary design expertise

 

TeseoVI

Single-die, simultaneous quad-band (L1+L2+L5+E6) GNSS devices using ST’s proprietary phase-change memory with a single configurable firmware binary for multi-band reception up to quad band.

 

TeseoV

GNSS receiver ICs, offering on-chip, dual and triple (L1+L5 or L1+L2+L5), multi-constellation, carrier-phase tracking for higher accuracy and precise positioning and autonomous position, velocity and time (PVT) calculations on a single chip.

 

TeseoIV

Tiny, dual-band, low-power GNSS module

 

TeseoIII

Standalone GNSS-L1 receiver ICs with reduced power consumption, carrier-phase tracking for higher accuracy, and support for Read-only Memory (ROM).